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BAS16J
Single high-speed switching diode
Rev. 01 -- 8 March 2007 Product data sheet
1. Product profile
1.1 General description
Single high-speed switching diode, encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.
1.2 Features
I High switching speed: trr 4 ns I Low leakage current I Repetitive peak reverse voltage: VRRM 100 V I Excellent coplanarity and improved thermal behavior I Low capacitance: Cd 1.5 pF I Reverse voltage: VR 100 V I Very small and flat lead SMD plastic package
1.3 Applications
I High-speed switching I General-purpose switching I Voltage clamping I Reverse polarity protection
1.4 Quick reference data
Table 1. Symbol IF IR VR trr
[1] [2]
Quick reference data Parameter forward current reverse current reverse voltage reverse recovery time
[2]
Conditions
[1]
Min -
Typ -
Max 250 1 100 4
Unit mA A V ns
VR = 75 V
Pulse test: tp 300 s; 0.02. When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
NXP Semiconductors
BAS16J
Single high-speed switching diode
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
1 2
Symbol
sym006
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name BAS16J SC-90 Description plastic surface-mounted package; 2 leads Version SOD323F Type number
4. Marking
Table 4. BAS16J Marking codes Marking code AR Type number
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
2 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VRRM VR IF IFRM IFSM Parameter repetitive peak reverse voltage reverse voltage forward current repetitive peak forward current non-repetitive peak forward current tp 0.5 ms; 0.25 square wave tp = 100 s tp = 1 ms tp = 10 ms Ptot Tj Tamb Tstg
[1] [2] [3] [4]
[2] [1]
Conditions
Min -
Max 100 100 250 500
Unit V V mA mA
[3][4]
3.3 2 1.5 550 150 +150 +150
A A A mW C C C
total power dissipation junction temperature ambient temperature storage temperature
Pulse test: tp 300 s; 0.02. Tj = 25 C prior to surge.
Tamb 25 C
-65 -65
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Rth(j-sp)
[1] [2] [3]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1][2]
Min -
Typ -
Max 230 55
Unit K/W K/W
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Reflow soldering is the only recommended soldering method. Soldering point of cathode tab.
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
3 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter VF forward voltage IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current VR = 25 V VR = 75 V VR = 25 V; Tj = 150 C VR = 75 V; Tj = 150 C Cd trr VFR
[1] [2] [3]
Conditions
[1]
Min [2] [3]
Typ -
Max 715 855 1 1.25 30 1 30 50 1.5 4 1.75
Unit mV mV V V nA A A A pF ns V
diode capacitance reverse recovery time forward recovery voltage
Pulse test: tp 300 s; 0.02.
VR = 0 V; f = 1 MHz
-
When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. When switched from IF = 10 mA; tr = 20 ns.
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
4 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
300 IF (mA)
(1) (2) (3)
mbg382
10
006aaa308
IFSM (A)
200
100
0
0
1
VF (V)
2
1 10-2
10-1
1 tp (ms)
10
(1) Tamb = 150 C; typical values (2) Tamb = 25 C; typical values (3) Tamb = 25 C; maximum values
Based on square wave currents. Tj = 25 C; prior to surge
Fig 1. Forward current as a function of forward voltage
mga884
Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values
mbg446
105
0.8 Cd (pF)
IR (nA)
104
(1)
0.6
103
(2)
0.4
(3)
102
0.2
10
0
0 100 Tj (C) 200
0
4
8
12
VR (V)
16
(1) VR = 75 V; maximum values (2) VR = 75 V; typical values (3) VR = 25 V; typical values
f = 1 MHz; Tamb = 25 C
Fig 3. Reverse current as a function of junction temperature
Fig 4. Diode capacitance as a function of reverse voltage; typical values
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
5 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
8. Test information
tr D.U.T. RS = 50 V = VR + IF x RS IF SAMPLING OSCILLOSCOPE Ri = 50 VR
mga881
tp t
10 % + IF trr t
90 % input signal output signal
(1)
(1) IR = 1 mA Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle = 0.05 Oscilloscope: rise time tr = 0.35 ns
Fig 5. Reverse recovery time test circuit and waveforms
I 1 k 450
I
90 %
V
RS = 50 D.U.T.
OSCILLOSCOPE Ri = 50 10 % t tr tp input signal
VFR
t output signal
mga882
Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp 100 ns; duty cycle 0.005
Fig 6. Forward recovery voltage test circuit and waveforms
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
6 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
9. Package outline
1.35 1.15 1 0.5 0.3 0.80 0.65
2.7 2.3
1.8 1.6
2 0.40 0.25 Dimensions in mm 0.25 0.10 04-09-13
Fig 7. Package outline SOD323F (SC-90)
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAS16J
[1]
Package SOD323F
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
For further information and the availability of packing methods, see Section 14.
11. Soldering
3.05 2.80 2.10 1.60
solder lands solder resist
1.65
0.95
0.50
0.60 occupied area solder paste
0.50 (2x)
001aab169
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 8. Reflow soldering footprint SOD323F (SC-90)
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
7 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
12. Revision history
Table 9. BAS16J_1 Revision history Release date 20070308 Data sheet status Product data sheet Change notice Supersedes Document ID
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
8 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
BAS16J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
9 of 10
NXP Semiconductors
BAS16J
Single high-speed switching diode
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information. . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 March 2007 Document identifier: BAS16J_1

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